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Mô tả
Mô tả
The world’s best performance 3D SPI
– Super high resolution CXP camera and precision 6㎛ lens
– Solder paste inspection up to 0201(㎜) size component pad
– 20㎛ height solder paste inspection
– Shadow-free dual projection 3D measurement
– High accuracy and repeatability with linear motor drive system
Auto PCB warpage compensation
Closed-Loop System : Optimize the manufacturing process by connection with Screen Printer and Pick & Place Machine
Intellisys® : Total process management system for improving productivity and achieving smart factory
High precision 3D SPI that can be applied to solder paste inspection of semiconductor second process, mini-LED and micro-LED
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Hãy là người đầu tiên nhận xét “Máy SPI MS-15 Series”
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